Tutorials: 28 October 2012

Tutorial Fees

*Fees are listed in USD

 Tutorial Fees Advanced On-site
 IEEE Member
200 250
 Non-Member
250 300
 Student/Life Member
150 150

Tutorial Sessions

 

Time Parallel Session 1: Sensors and Sensing Technologies, Rm. 101A
Parallel Session 2: Sensing System Integration and Application, Rm. 101D
8:00-8:30 Registration Registration
8:30- 10:10

Topic: Nanoscale Electromechanical Sensors and their Emerging Applications

Presenter:
Prof. Philip Feng, Case Western Reserve University, Assistant Professor of Electrical Engineering

Topic: Fire Detection System Design for Reliability

Presenter:
Dr. Anis Zribi, United Technologies Corp., USA, Global Detection Technology Manager at Kidde Safety

 

10:10-10:30 BREAK BREAK
10:30-12:10

Topic: Optomechanics: How Light Impacts Mechanics

Presenter:

Prof. Sunil Bhave,Cornell University, USA, Associate Professor, Electrical and Computer Engineering

Topic:  Heat Replaces Batteries to Power Wireless Sensors 

Presenter:
Mr. Wladimir Punt, Micropelt GmbH, Germany, VP Marketing & Sales


12:10-13:20 LUNCH LUNCH
13:20- 15:00

Topic: Wafer Level Vacuum Packaging for Sensors

Presenter:
Dr. Wan-Thai Hsu, Discera, USA, CTO of Discera

 

Topic: Optical Coherence Tomography-based Imaging and Sensing of Tissues and Cells

Presenter:
Prof. Kirill Larin, Univ. of Houston, USA, Associate Professor of Biomedical Engineering

15:00-15:20 BREAK BREAK
15:20-17:00 Topic: MEMS Design 

Presenter:
Dr. Jan Bienstman, IMEC, Belgium, Senior MEMS Design Support Engineer, INVOMEC

Topic: Analog, MEMS and Sensors enable our Mobile Devices into a SMART world

Presenter:
Mr. Robert Yu, STMicroelectronics, Senior Technical Marketing & Application Manager, Analog MEMS and Sensors Product Group / IMS